Articles/Papers
The Effect on Energy Use from an Optimized Reflow Oven Recipe in Lead-Free Applications
Abstract Due to the higher melting point of lead-free Sn-Ag-Cu alloy, higher reflow soldering temperatures are required for lead-free PCB assembly. Consequently, reflow oven energy consumption is growing as well. This research work is focused on the potential opportunity to…
The KIC 24/7
Abstract This paper will focus on recent advances in thermal process control and detail new methods for continuous automated process control. The status quo method of process control for the reflow process is to set the oven to previously determined…
Attaching Thermocouples for Solder Reflow Board Profiling Using High Temperature Solder
Application Note #00001 Rev: 98-05 Overview This Applications Note covers the attachment of thermocouple (TC) wires to a PCB for part profiling using high temperature solder. We recommend 10-88-2 solder for TC attachment because it does not start melting until…
Minimizing Reflow Temperature Differentials (DT) on Electronic Assemblies Using the KIC Navigator
Application Note #20001 Rev: 2008-02 Background The implementation of lead-free electronic assembly has raised several critical issues for electronics assemblers. One of the most critical is that the lead-free reflow process has a much tighter process window than the traditional…
Developing Common Reflow Oven Recipes for Mixed Production Lines Using the KIC Navigator
Application Note #20002 Rev: 2008-02 Background For electronics assemblers running high mix-low volume production, maximizing throughput can be critical. Changing over the screen printer and the pick and place rarely takes more than ten minutes. For changeover at the reflow…
Reduced Electricity Use Translates to Reduced Production Cost and Lower Carbon Footprint
Delta Group Electronics, Inc. is a high-mix, low-volume electronics manufacturing services (EMS) provider that serves the telecommunications, capital equipment, defense and aerospace industries. The company’s main focus across its five facilities is to provide cost-efficient, high-quality assembly for customers. The…
Advanced Thermal Process Management for Wave Solder Application – TRW Case Study
TRW, a full-service organization, from design to assembly, is a major player in the highly competitive automotive electronics contract manufacturing market. In this market, top-notch quality and on-time delivery are always expected. In addition, new requirements for full process traceability…
The Science Behind Conveyor Oven Thermal Profiling
The Science Behind Conveyor Oven Thermal Profiling By Philip Kazmierowicz Overview One of the main problems faced in Printed Circuit Board (PCB) assembly applications is the initial setting up, and the continuing control of the solder reflow process to obtain…
It Can’t Be That Easy!
By Frank MascettiPresidentTechnical Resources Corp.Boca Raton, FL It is rare that we witness a product that is truly revolutionary. My background is in electrical engineering, and I’ve held various manufacturing/test engineering jobs at Westinghouse and Racal-Milgo. I have been in…
Finding the Best Oven Recipe with the SlimKIC 2000 Using the Auto-Focus Software Option
Finding the Best Oven Recipe with the SlimKIC 2000 Using the Auto-Focus Software Option Ronald Chau, KIC, March 2003 Introduction The SlimKIC 2000™ is a tool that records the thermal profile of a product in a conveyorized thermal process such…
Profiling High-Reliability Assembly
Key features of an automated-reflow management system are product traceability and process documentation. The means: continuous and automatic thermal process monitoring. Paramit Corp. provides focused electronic manufacturing and test solutions to leading OEMs in various high technology industries. It has…
Wafer Bumping for Flip Chip Attach
There are five commonly used methods of wafer bumping for flip chip attach, three of which are challenging and expensive: Stud bumps formed by ball bonding using gold wire; plated gold bumps using electrolytic or electroless gold; and plating solder…