Application Notes
Common Reflow Oven Faults and Their Impact on Electronics Manufacturing
Introduction In the world of electronics manufacturing, quality control and consistency are everything. Reflow ovens play a critical role in the assembly process, heating solder paste to the correct temperature to ensure strong, reliable joints between components and printed circuit…
Attaching Thermocouples for Solder Reflow Board Profiling Using High Temperature Solder
Application Note #00001 Rev: 98-05 Overview This Applications Note covers the attachment of thermocouple (TC) wires to a PCB for part profiling using high temperature solder. We recommend 10-88-2 solder for TC attachment because it does not start melting until…
Minimizing Reflow Temperature Differentials (DT) on Electronic Assemblies Using the KIC Navigator
Application Note #20001 Rev: 2008-02 Background The implementation of lead-free electronic assembly has raised several critical issues for electronics assemblers. One of the most critical is that the lead-free reflow process has a much tighter process window than the traditional…
Developing Common Reflow Oven Recipes for Mixed Production Lines Using the KIC Navigator
Application Note #20002 Rev: 2008-02 Background For electronics assemblers running high mix-low volume production, maximizing throughput can be critical. Changing over the screen printer and the pick and place rarely takes more than ten minutes. For changeover at the reflow…