Application Notes
Attaching Thermocouples for Solder Reflow Board Profiling Using High Temperature Solder
Application Note #00001 Rev: 98-05 Overview This Applications Note covers the attachment of thermocouple (TC) wires to a PCB for part profiling using high temperature solder. We recommend 10-88-2 solder for TC attachment because it does not start melting until…
Minimizing Reflow Temperature Differentials (DT) on Electronic Assemblies Using the KIC Navigator
Application Note #20001 Rev: 2008-02 Background The implementation of lead-free electronic assembly has raised several critical issues for electronics assemblers. One of the most critical is that the lead-free reflow process has a much tighter process window than the traditional…
Developing Common Reflow Oven Recipes for Mixed Production Lines Using the KIC Navigator
Application Note #20002 Rev: 2008-02 Background For electronics assemblers running high mix-low volume production, maximizing throughput can be critical. Changing over the screen printer and the pick and place rarely takes more than ten minutes. For changeover at the reflow…