Articles/Papers
Common Reflow Oven Faults and Their Impact on Electronics Manufacturing
Introduction In the world of electronics manufacturing, quality control and consistency are everything. Reflow ovens play a critical role in the assembly process, heating solder paste to the correct temperature to ensure strong, reliable joints between components and printed circuit…
Maximizing Efficiency in PCB Assembly
A Guide for Engineering and Production Managers Using Advanced Data Analytics
Unlocking Synergies
The U.S. CHIPS Act Propels Collaboration Between Semiconductor Manufacturers and Equipment Suppliers.
Process Control in Solder and Reflow
Interview by Nolan Johnson | I-CONNECT007 Nolan Johnson speaks with KIC’s Miles Moreau to get his perspective on topics such as wave process inspection (WPI), wave solder, and vacuum reflow, and how they will fit into Industry 4.0 and smart…
Automatic Reflow Profiling and Data Analytics
Presented at SMTA International 2020 Karl D. Pfluke and MB Allen KIC CA, USA Abstract With the advent of i4.0 and Smart Factory, there has been a great deal of technology put into SMT lines that are manufacturing…
KIC’s Ecosystem: Solutions to Your Thermal Reflow Problems
By David Wilson, Competitive Edge Solutions LLC In the sales world it’s advantageous to carry products that are understandable, impactful and easy to use. Customers appreciate this type of performance in products and in sales. KIC and its ecosystem of…
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues Eric Bastow Indium Corporation Clinton, New York Abstract An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,…
Reflow Your Solder and Your Data for Industry 4.0
I-Connect007 Managing Editor Nolan Johnson recently spoke with KIC President and Founder Phil Kazmierowicz and Manager of Applications and Sales MB “Marybeth” Allen as they each transitioned into new roles in the KIC leadership team. The conversation ultimately turned to…
What the Heck do These Fancy Industry 4.0 Technologies Actually do for Me?
By KIC Introduction One reason the Industry 4.0 / Smart factory technology trend in electronics manufacturing is moving slowly is due to developers like us not having done a good job demonstrating the concrete impact on users, along with the…
Optimized Reflow Profiling to Minimize Voiding
By MB Allen, Manager, KIC In this whitepaper we discuss several aspects of the challenges of PCB voiding with bottom terminated components (BTCs). This includes what voiding is, the causes and its effect on components. We will look at the…
How We Won the Regional Competition at Calsonic for Reflow Quality and Cost Improvements
By Rod Sampson, Process Engineer Calsonic Kansei is a multinational automotive parts manufacturer with its own branded OEM products. Recently, the company was acquired by the private equity firm KKR, and it is poised for dynamic global outreach. The company’s…
Reflow Profiling for Next-Generation Solder Alloys
Reflow Profiling for Next-Generation Solder Alloys Authored by: MB Allen, KIC San Diego, CA, USA [email protected] And Meagan Sloan, Kim Flanagan, Brook Sandy-Smith, Indium Corporation Clinton, NY, USA [email protected], [email protected], [email protected] ABSTRACT: After the Pb-free transition, most of the industry…