Conference Papers

Introduction There is a growing need for new technology to increase the level of control for continuous belt brazing processes. Consumer demand for lighter, smaller, more efficient products and increased regulation focusing on environmental and recycling issues are just two…

Abstract This paper will focus on recent advances in thermal process control and detail new methods for continuous automated process control. The status quo method of process control for the reflow process is to set the oven to previously determined…

Edward [email protected] Outline Reflow Phases Preheat Pre-reflow Reflow Cooling Preheat Ramp Rate Factors Affecting Reflow Process Window Solder Defects Tombstoning Unbalanced wetting forces – leadless component Profile recommendations Solder Beading Solder Balling Small particles isolated from solder joint Solder Beading/Balling…

Abstract This paper will focus on recent advances in thermal profiling and process control. Several factors are causing a renewed focus on the soldering process. The specter of lead-free electronics assembly has raised concerns with the increased peak temperatures that…

Abstract Recent advances in reflow technology have made it possible for cutting edge thermal profiling software to interface with modern furnace controllers. This paper will discuss the reasons thermal profiling has become critical, the process by which thermal profiling software…

Finding A Quick And Reliable Method For Attaching Thermocouples As more PCB assemblers become aware of the value of regular process monitoring, the frequency of thermal profiling is increasing dramatically. High temperature solder is recognized in the SMT industry as…

Overview Until recently, reflow ovens, vertical ovens, and wave solder machines have been difficult to include in an SPC program. Screen printers and pick & place machines have had the capability to output valid SPC data for years. Developments in…