White Papers
Automatic Reflow Profiling and Data Analytics
Presented at SMTA International 2020 Karl D. Pfluke and MB Allen KIC CA, USA Abstract With the advent of i4.0 and Smart Factory, there has been a great deal of technology put into SMT lines that are manufacturing…
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues Eric Bastow Indium Corporation Clinton, New York Abstract An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,…
Optimized Reflow Profiling to Minimize Voiding
By MB Allen, Manager, KIC In this whitepaper we discuss several aspects of the challenges of PCB voiding with bottom terminated components (BTCs). This includes what voiding is, the causes and its effect on components. We will look at the…
Reflow Profiling for Next-Generation Solder Alloys
Reflow Profiling for Next-Generation Solder Alloys Authored by: MB Allen, KIC San Diego, CA, USA [email protected] And Meagan Sloan, Kim Flanagan, Brook Sandy-Smith, Indium Corporation Clinton, NY, USA [email protected], [email protected], [email protected] ABSTRACT: After the Pb-free transition, most of the industry…
Making Ovens Smarter
Making Ovens Smarter Time to turn-up the heat to focus on oven intelligence This white paper sets out the anomaly that is the lack of intelligence available in ovens compared to elsewhere on the production line and the clear benefits…
Best Practices Reflow Profiling for Lead-Free SMT Assembly
Best Practices Reflow Profiling for Lead-Free SMT Assembly Indium Corporation Tech Paper Authored by: Ed Briggs and Ronald C. Lasky, Ph.D.,PE ABSTRACT The combination of higher lead-free process temperatures, smaller print deposits, and temperature restraints on electrical components has created…
Process Guidelines to Ensure Optimal SMT Electronics Assembly
Indium Corporation Tech Paper Authored by: Ed Briggs and Ronald C. Lasky, PhD, PE. Abstract The continuing miniaturization of personal electronics devices, such as mobile phones, personal music devices, and personal computing devices has driven the need for increasingly smaller…
Evaluating the Accuracy of a Non-Destructive Thermocouple Attach Method for Area-Array Package Profiling
Evaluating the Accuracy of a Non-Destructive Thermocouple Attach Method for Area-Array Package Profiling Tim Grove and Dr. S. Manian Ramkumar, Center for Electronics Manufacturing and Assembly, Rochester Institute of Technology, Rochester, NY Brian O’Leary, KIC, San Diego Introduction The oven…
Reducing Power Consumption by Selecting Optimal Oven Recipes
By Abhinav Ajmera, Sreekanth Varma Penmatsa and Prof. S. Manian Ramkumar for KIC The goal of this article is to study the efficiency of the KIC 2000’s Auto-Focus Power option to select an optimal oven recipe for reduced power consumption…
Ultimately, What is Job # 1 for a Reflow Oven? Think about It!
Reflow ovens and wave solder machines come in a huge variety of flavors and price points. The spec sheets for these machines tell the story of impressive features and capabilities such as flux management, gas flow management, static pressure control,…
Lead-Free: New Problems – New Solutions
Over the past several decades the electronics assembly industry has perfected efficient and high quality manufacturing of leaded assemblies. Today we are faced with disruptive changes required by the production of Lead-Free electronics. Manufacturers are discovering that their old,…
Case Study: Increased Productivity and Zero-Defect Soldering at BB Electronics
Introduction BB Electronics is the leading provider of EMS services in Denmark, catering to OEMs requiring high reliability and quality standards. BB Electronics specializes in the assembly of high mix, low to medium volume telecommunications and IT boards, and provides…