Lead-Free: New Problems – New Solutions

  Over the past several decades the electronics assembly industry has perfected efficient and high quality manufacturing of leaded assemblies. Today we are faced with disruptive changes required by the production of Lead-Free electronics. Manufacturers are discovering...

Measuring the Accuracy of the KIC MVP

Introduction KIC has introduced a product called the “Manual Virtual Profiler” or MVP™. The MVP is a process monitoring system that allows the electronic assembler to check the profile of the solder reflow process without running a real Printed Circuit...

Manufacturing Efficiencies

The Concept The electronic assembly and semiconductor industries have now matured to the point where most of the remaining manufacturers have learned to run volume production with consistent quality. Unfortunately that is no longer enough to stay in business. The...

The KIC 24/7

Abstract This paper will focus on recent advances in thermal process control and detail new methods for continuous automated process control. The status quo method of process control for the reflow process is to set the oven to previously determined temperature...

The Science Behind Conveyor Oven Thermal Profiling

The Science Behind Conveyor Oven Thermal Profiling By Philip Kazmierowicz Overview One of the main problems faced in Printed Circuit Board (PCB) assembly applications is the initial setting up, and the continuing control of the solder reflow process to obtain optimal...