by KIC | Nov 11, 2020 | White Papers
Optimized Reflow Profiling to Minimize Voiding By MB Allen, Manager, KIC In this whitepaper we discuss several aspects of the challenges of PCB voiding with bottom terminated components (BTCs). This includes what voiding is, the causes and its effect on components. We...
by KIC | Oct 21, 2020 | White Papers
Presented at SMTA International 2020 Karl D. Pfluke and MB Allen KIC CA, USA Abstract With the advent of i4.0 and Smart Factory, there has been a great deal of technology put into SMT lines that are manufacturing the very technologies we use today. Data...
by KIC | Apr 17, 2020 | White Papers
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues Eric Bastow Indium Corporation Clinton, New York Abstract An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process, largely due...
by KIC | Dec 14, 2018 | White Papers
Reflow Profiling for Next-Generation Solder Alloys Authored by MB Allen, KIC San Diego, CA, USA mballen@kicmail.com And Meagan Sloan, Kim Flanagan, Brook Sandy-Smith, Indium Corporation Clinton, NY, USA msloan@indium.com, kflanafan@indium.com, bsandy@indium.com...
by KIC | Aug 4, 2016 | White Papers
Making Ovens Smarter Time to turn-up the heat to focus on oven intelligence This white paper sets out the anomaly that is the lack of intelligence available in ovens compared to elsewhere on the production line and the clear benefits of making the oven smarter. If...
by KIC | Jun 2, 2016 | White Papers
Best Practices Reflow Profiling for Lead-Free SMT Assembly Indium Corporation Tech Paper Authored by: Ed Briggs and Ronald C. Lasky, Ph.D.,PE ABSTRACT The combination of higher lead-free process temperatures, smaller print deposits, and temperature restraints on...
