by KIC | Mar 11, 2019 | White Papers
By MB Allen, Manager, KIC In this whitepaper we discuss several aspects of the challenges of PCB voiding with bottom terminated components (BTCs). This includes what voiding is, the causes and its effect on components. We will look at the challenges and some...
by KIC | Dec 14, 2018 | White Papers
Reflow Profiling for Next-Generation Solder Alloys Authored by MB Allen, KIC San Diego, CA, USA mballen@kicmail.com And Meagan Sloan, Kim Flanagan, Brook Sandy-Smith, Indium Corporation Clinton, NY, USA msloan@indium.com, kflanafan@indium.com, bsandy@indium.com...
by KIC | Aug 4, 2016 | White Papers
Making Ovens Smarter Time to turn-up the heat to focus on oven intelligence This white paper sets out the anomaly that is the lack of intelligence available in ovens compared to elsewhere on the production line and the clear benefits of making the oven smarter. If...
by KIC | Jun 2, 2016 | White Papers
Best Practices Reflow Profiling for Lead-Free SMT Assembly Indium Corporation Tech Paper Authored by: Ed Briggs and Ronald C. Lasky, Ph.D.,PE ABSTRACT The combination of higher lead-free process temperatures, smaller print deposits, and temperature restraints on...
by KIC | Jun 1, 2016 | White Papers
Indium Corporation Tech Paper Authored by: Ed Briggs and Ronald C. Lasky, PhD, PE. Abstract The continuing miniaturization of personal electronics devices, such as mobile phones, personal music devices, and personal computing devices has driven the need for...
by KIC | Apr 29, 2016 | White Papers
Evaluating the Accuracy of a Non-Destructive Thermocouple Attach Method for Area-Array Package Profiling Tim Grove and Dr. S. Manian Ramkumar, Center for Electronics Manufacturing and Assembly, Rochester Institute of Technology, Rochester, NY Brian O’Leary, KIC,...
