Optimized Reflow Profiling to Minimize Voiding

By MB Allen, Manager, KIC In this whitepaper we discuss several aspects of the challenges of PCB voiding with bottom terminated components (BTCs). This includes what voiding is, the causes and its effect on components. We will look at the challenges and some...

Reflow Profiling for Next-Generation Solder Alloys

Reflow Profiling for Next-Generation Solder Alloys Authored by MB Allen, KIC   San Diego, CA, USA mballen@kicmail.com And Meagan Sloan, Kim Flanagan, Brook Sandy-Smith, Indium Corporation   Clinton, NY, USA msloan@indium.com, kflanafan@indium.com, bsandy@indium.com...

Making Ovens Smarter

Making Ovens Smarter Time to turn-up the heat to focus on oven intelligence This white paper sets out the anomaly that is the lack of intelligence available in ovens compared to elsewhere on the production line and the clear benefits of making the oven smarter.   If...