by KIC | Jul 6, 2013 | Conference Papers
Practical Thermal Profile Expectations in a Dual-Lane, Dual-Speed Reflow Oven
by KIC | Oct 5, 2012 | Conference Papers
Abstract This paper will focus on recent advances in thermal process control and detail new methods for continuous automated process control. The status quo method of process control for the reflow process is to set the oven to previously determined temperature...
by KIC | Sep 11, 2012 | Conference Papers
Optimizing Reflow Profiling in Lead-free SMT Assembly.pdf
by KIC | Jul 20, 2012 | Conference Papers
Abstract This paper will focus on recent advances in thermal profiling and process control. Several factors are causing a renewed focus on the soldering process. The specter of lead-free electronics assembly has raised concerns with the increased peak temperatures...
by KIC | Jul 20, 2012 | Conference Papers
Abstract Recent advances in reflow technology have made it possible for cutting edge thermal profiling software to interface with modern furnace controllers. This paper will discuss the reasons thermal profiling has become critical, the process by which thermal...
by KIC | Feb 23, 1999 | Conference Papers
Finding A Quick And Reliable Method For Attaching Thermocouples As more PCB assemblers become aware of the value of regular process monitoring, the frequency of thermal profiling is increasing dramatically. High temperature solder is recognized in the SMT industry as...
