Abstract This paper will focus on recent advances in thermal process control and detail new methods for continuous automated process control. The status quo method of process control for the reflow process is to set the oven to previously determined temperature...
Abstract This paper will focus on recent advances in thermal profiling and process control. Several factors are causing a renewed focus on the soldering process. The specter of lead-free electronics assembly has raised concerns with the increased peak temperatures...
Abstract Recent advances in reflow technology have made it possible for cutting edge thermal profiling software to interface with modern furnace controllers. This paper will discuss the reasons thermal profiling has become critical, the process by which thermal...
Finding A Quick And Reliable Method For Attaching Thermocouples As more PCB assemblers become aware of the value of regular process monitoring, the frequency of thermal profiling is increasing dramatically. High temperature solder is recognized in the SMT industry as...
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