Optimized Reflow Profiling to Minimize Voiding

By MB Allen, Manager, KIC In this whitepaper we discuss several aspects of the challenges of PCB voiding with bottom terminated components (BTCs). This includes what voiding is, the causes and its effect on components. We will look at the challenges and some...

Reflow Profiling for Next-Generation Solder Alloys

Reflow Profiling for Next-Generation Solder Alloys Authored by MB Allen, KIC   San Diego, CA, USA mballen@kicmail.com And Meagan Sloan, Kim Flanagan, Brook Sandy-Smith, Indium Corporation   Clinton, NY, USA msloan@indium.com, kflanafan@indium.com, bsandy@indium.com...

Connectivity for Improved Utilization and Quality

M2M communication for continuous monitoring and support Connectivity for Improved Utilization and Quality With the accelerated pace of Industry 4.0 and smart PCB manufacturing implementation in electronics manufacturing, process engineers and production managers need...