Process Control in Solder and Reflow

Interview by Nolan Johnson     I-CONNECT007 Nolan Johnson speaks with KIC’s Miles Moreau to get his perspective on topics such as wave process inspection (WPI), wave solder, and vacuum reflow, and how they will fit into Industry 4.0 and smart factories. Nolan Johnson:...

Optimized Reflow Profiling to Minimize Voiding

Optimized Reflow Profiling to Minimize Voiding By MB Allen, Manager, KIC In this whitepaper we discuss several aspects of the challenges of PCB voiding with bottom terminated components (BTCs). This includes what voiding is, the causes and its effect on components. We...

Automatic Reflow Profiling and Data Analytics

Presented at SMTA International 2020 Karl D. Pfluke and MB Allen    KIC     CA, USA Abstract With the advent of i4.0 and Smart Factory, there has been a great deal of technology put into SMT lines that are manufacturing the very technologies we use today.  Data...
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