Reflow Your Solder and Your Data for Industry 4.0

I-Connect007 Managing Editor Nolan Johnson recently spoke with KIC President and Founder Phil Kazmierowicz and Manager of Applications and Sales MB “Marybeth” Allen as they each transitioned into new roles in the KIC leadership team. The conversation ultimately turned...

Optimized Reflow Profiling to Minimize Voiding

By MB Allen, Manager, KIC In this whitepaper we discuss several aspects of the challenges of PCB voiding with bottom terminated components (BTCs). This includes what voiding is, the causes and its effect on components. We will look at the challenges and some...

Reflow Profiling for Next-Generation Solder Alloys

Reflow Profiling for Next-Generation Solder Alloys Authored by MB Allen, KIC   San Diego, CA, USA mballen@kicmail.com And Meagan Sloan, Kim Flanagan, Brook Sandy-Smith, Indium Corporation   Clinton, NY, USA msloan@indium.com, kflanafan@indium.com, bsandy@indium.com...