Evaluating the Accuracy of a Non-Destructive Thermocouple Attach Method for Area-Array Package Profiling

Evaluating the Accuracy of a Non-Destructive Thermocouple Attach Method for Area-Array Package Profiling Tim Grove and Dr. S. Manian Ramkumar, Center for Electronics Manufacturing and Assembly, Rochester Institute of Technology, Rochester, NY Brian O’Leary, KIC, San Diego Introduction The oven recipe, which consists of the reflow oven zone temperature settings and the speed of the … Continue reading Evaluating the Accuracy of a Non-Destructive Thermocouple Attach Method for Area-Array Package Profiling