White Papers
Lead-Free: New Problems – New Solutions
Over the past several decades the electronics assembly industry has perfected efficient and high quality manufacturing of leaded assemblies. Today we are faced with disruptive changes required by the production of Lead-Free electronics. Manufacturers are discovering that their old,…
Case Study: Increased Productivity and Zero-Defect Soldering at BB Electronics
Introduction BB Electronics is the leading provider of EMS services in Denmark, catering to OEMs requiring high reliability and quality standards. BB Electronics specializes in the assembly of high mix, low to medium volume telecommunications and IT boards, and provides…
Measuring the Accuracy of the KIC MVP
Introduction KIC has introduced a product called the “Manual Virtual Profiler” or MVP™. The MVP is a process monitoring system that allows the electronic assembler to check the profile of the solder reflow process without running a real Printed Circuit…
Manufacturing Efficiencies
The Concept The electronic assembly and semiconductor industries have now matured to the point where most of the remaining manufacturers have learned to run volume production with consistent quality. Unfortunately that is no longer enough to stay in business. The…
The Effect on Energy Use from an Optimized Reflow Oven Recipe in Lead-Free Applications
Abstract Due to the higher melting point of lead-free Sn-Ag-Cu alloy, higher reflow soldering temperatures are required for lead-free PCB assembly. Consequently, reflow oven energy consumption is growing as well. This research work is focused on the potential opportunity to…
The KIC 24/7
Abstract This paper will focus on recent advances in thermal process control and detail new methods for continuous automated process control. The status quo method of process control for the reflow process is to set the oven to previously determined…
The Science Behind Conveyor Oven Thermal Profiling
The Science Behind Conveyor Oven Thermal Profiling By Philip Kazmierowicz Overview One of the main problems faced in Printed Circuit Board (PCB) assembly applications is the initial setting up, and the continuing control of the solder reflow process to obtain…
Finding the Best Oven Recipe with the SlimKIC 2000 Using the Auto-Focus Software Option
Finding the Best Oven Recipe with the SlimKIC 2000 Using the Auto-Focus Software Option Ronald Chau, KIC, March 2003 Introduction The SlimKIC 2000™ is a tool that records the thermal profile of a product in a conveyorized thermal process such…