White Papers, Magazine Articles
and Conference Papers

White Papers

• Evaluating the new KIC Navigator Option to Select Optimal Oven Recipe for Reduced Power Consumption, for Sn-Pb and Pb-Free Reflow Soldering
• The Effect on Energy Use from an Optimized Reflow Oven Recipe in Lead-Free Applications
• Lead-Free: New Problems - New Solutions
• Measuring the Accuracy of the KIC 24/7 Virtual Profiles
• Finding the Best Oven Setup with the SlimKIC 2000 Using the Auto-Focus Software Option
• Manufacturing Efficiencies: Get the most out of your equipment and personnel
• The KIC 24/7 White Paper
• Using the Internet with Real-time Reflow Data Collection for Process Monitoring and Quality Control
• CASE STUDY: Increased Productivity and Zero Defect Soldering at BB Electronics
• Accuracy of the Prophet Thermal Manager Virtual Profiling Tool
• Accuracy of The WinKIC Prediction Tool In a Forced Convection Solder Reflow Oven
• The Science Behind Conveyor Oven Thermal Profiling

Magazine Articles

• CASE STUDY--Supporting Niche Service Needs, Global SMT, Jan 2009
• Silicon Solar Cell Efficiency Increases Demonstrated by Thermal Process Optimization in the Metallization Process, Global Solar, Oct 2009
• Delta Reduces Energy Use, Global SMT, June 2009
• Bill Pasco, Garmin AT: Thermal Profiler/Prediction Comparison, Circuitnet, Jan 2009
• CASE STUDY: Advanced thermal process management for wave solder application, Global SMT, Sep 2007
• Interview - Bjorn Dahle, KIC, Global SMT, May 2007
• It Can't Be That Easy!, leadfreemagazine.com, Nov 2005
• Profiling High-reliability Assembly, SMT Magazine, Jun 2003
• Wafer Bumping for Flip Chip Attach (Step 5: The Back-end Process), Advanced Packaging, May 2003
• Production Migration: Do the Numbers Add Up?, EP&P Magazine, Jan 2003
• SMT Magazine Cover Story -- The Case for Upgrading the Reflow Process, SMT Magazine, May 2002
• PWI: Process Optimization Made Simple, Circuits Assembly Magazine, Feb 2002
• SMT Magazine Step by Step -- Step 2: Process Control, SMT Magazine, Feb 2002
• It's All About Profitability, EP&P Magazine, Nov 2001
• Smart Profiling: Tips for Optimizing Thermal Process Performance, Process Heating, Sep 2001
• Increasing Profit Potential with Precision Control and Monitoring of the Reflow Process, EP&P Magazine, Jun 2001
• Are You Ready for Lead-Free Assembly?, SMT Magazine, Jun 2000
• Thermal Process Optimization and Monitoring for Long-term Product Reliability, Circuits Assembly Magazine, May 2000
• A Period of Adjustment, Chip Scale Review, Mar 2000
• Maximizing Reflow Yield with Advanced No-clean Ovens and Real-time Thermal Managers, SMT Magazine, Aug 1999
• Introducing SPC to the Reflow Process, SMT Magazine, Nov 1998
• SlimKIC and Auto-Predict Test Report, Circuits Assembly Magazine, Dec 1998
• KIC Prophet: Zero Defect Production Tool, EPP Europe Magazine, May 1998
• CASE STUDY: Chrysler, EP&P Magazine, 1998
• Finding a Thermal Profiler To Match Your Application, Process Heating Magazine, Apr 1996

Conference Papers

• Optimizing Your Reflow Profile for Maximum Productivity and Profitability, Presented at APEX 2004
• Taking the Pain Out of Pb-free Reflow, Presented at APEX 2003
• Processing of Fluxing Underfills for Flip Chip-on-Laminate Assembly, Presented at APEX 2002
• Automated Process Control for the Reflow Process, Presented at SMTA 2001
• Automated Process Development and Monitoring for Continuous Belt Brazing Processes, Presented at ASM 2001
• Improved Thermal Process Control for Lead-free Assembly, Presented at APEX 2001
• Increasing Reflow Process Efficiency and Yield with Automated Reflow Setup, Presented at APEX 2001
• Advances in Thermal Profiling for Reflow Process Control, Presented at SMTA 2000
• Integrated Profiling for the Reflow Process, Presented at APEX 2000
• Remote Monitoring of the Reflow Process, Presented at APEX 2000
• Thermal Profiling in the Twenty-First Century, Presented at NEPCON WEST 2000
• Firing Thick Films in a Muffle-less Furnace with Real-time Process Monitoring, Presented at IMAPS 1999
• A Comparison of Methods for Attaching TCs to PCBs for Thermal Profiling, Presented at NEPCON WEST 1999
• Reducing Oven Changeover Time by Finding Common Recipes for Mixed Production Lines, Presented at NEPCON WEST 1999
• Applying Real-time SPC to Thermal Process Management, Presented at NEPCON WEST 1999

For detailed Sales and Product Information, send email to sales@kicmail.com.
KIC's Marketing Department can also be reached via email at mktg@kicmail.com

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