White Papers
- Reducing Power Consumption by Selecting Optimal Oven Recipes
- Evaluating the Accuracy of a Non-Destructive Thermocouple Attach Method for Area-Array Package Profiling
- Process Guidelines to Ensure Optimal SMT Electronics Assembly by Indium Corporation
- Best Practices Reflow Profiling for Lead-Free SMT Assembly by Indium Corporation
- Measuring the Accuracy of the KIC MVP
- The Effect on Energy Use from an Optimized Reflow Oven Recipe in Lead-Free Applications
- Lead-Free: New Problems – New Solutions
- Manufacturing Efficiencies
- The KIC 24/7
- Using the Internet with Real-Time Reflow Data Collection for Process Monitoring and Quality Control
- Case Study: Increased Productivity and Zero-Defect Soldering at BB Electronics
- Evaluating the new KIC Navigator Option to Select Optimal Oven Recipe for Reduced Power Consumption, for Sn-Pb and Pb-Free Reflow Soldering
- Measuring the Accuracy of the KIC 24/7 Virtual Profiles
- Finding the Best Oven Recipe with the SlimKIC 2000 Using the Auto-Focus Software Option
- Accuracy of the Prophet Thermal Manager Virtual Profiling Tool
- Accuracy of The WinKIC Prediction Tool In a Forced Convection Solder Reflow Oven
- The Science Behind Conveyor Oven Thermal Profiling